Title:
高周波スイッチモジュール
Document Type and Number:
Japanese Patent JP4525949
Kind Code:
B2
Abstract:
A laminated high-frequency switch module for selectine either a transmission circuit or a reception circuit of each of transmission/reception systems by switching, comprising a demultiplexer for demultiplexing signals of the transmission/reception systems, high-frequency switch circuits for selecting either the signal path of a reception signal from the demultiplexer to the reception circuit or the signal path of a transmission signal from the transmission circuit to the demultiplexer, and means for measuring the power of the transmission signal from the transmission circuit, characterized in that the laminate is composed of dielectric layers having electrode patterns, and the demultiplexer, the high-frequency switch circuits, and the power measuring means are constituted of electrode patterns in the laminate.
More Like This:
| JPS56149830 | BRANCH AND COMPOSITION SYSTEM |
| JPH1084267 | RF SWITCH AND MOBILE COMMUNICATION DEVICE |
Inventors:
Hiroyuki Tadai
Shigeru Kamochi
Mitsuhiro Watanabe
Shigeru Kamochi
Mitsuhiro Watanabe
Application Number:
JP2009278894A
Publication Date:
August 18, 2010
Filing Date:
December 08, 2009
Export Citation:
Assignee:
Hitachi Metals Co., Ltd.
International Classes:
H04B1/44; H04B1/48
Domestic Patent References:
| JP11274804A | ||||
| JP11220312A | ||||
| JP2003008470A |
Foreign References:
| EP0921642A1 | ||||
| EP0837516A1 |
Attorney, Agent or Firm:
Takaishi Tachibana