Title:
サーマルインターフェース材料用組成物及びその使用方法、並びにサーマルインターフェース材料を含む装置
Document Type and Number:
Japanese Patent JP4532267
Kind Code:
B2
Abstract:
A composition that can be used to prepare a thermal interface material includes: A) a curable matrix having a curing temperature, B) a metal filler having a low melting point, optionally C) a spacer, and optionally D) a conductive filler. The temperature at which component B) commences softening is less than the curing temperature of component A). A thermal interface material is prepared by: 1) interposing the composition between an electronic component and a heat spreader to form a bondline, 2) heating the composition to a temperature higher than the temperature at which component B) commences softening but less than the curing temperature of component A) and optionally applying pressure to the composition, and 3) heating the composition to a temperature greater than or equal to the curing temperature of component A). The average particle size of component B) is greater than or equal to the bondline thickness.
Inventors:
Bugweger, Dolove
Application Number:
JP2004515626A
Publication Date:
August 25, 2010
Filing Date:
April 08, 2003
Export Citation:
Assignee:
DOW CORNING CORPORATION
International Classes:
C08L101/00; C08K3/00; C08L83/04; C09J5/06; C09J9/02; H01B1/22; H01L23/373; H01L23/433; C08L83/00; H01L23/367
Domestic Patent References:
| JP7207160A | ||||
| JP2000517092A | ||||
| JP2001300275A |
Attorney, Agent or Firm:
Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Kazuhiro Oyaku
Satoshi Iino
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Kazuhiro Oyaku
Satoshi Iino