Title:
撮像装置
Document Type and Number:
Japanese Patent JP4539172
Kind Code:
B2
Abstract:
To reduce manufacturing cost by eliminating the need for a foundation processing, a wiring or the like at a time, when a temperature sensor is mounted on an imaging device.
The image sensing device has a CCD, a Peltier element cooling the CCD, and a flexible board 20 electrically connected to an electrode for the CCD and used for electrical connections with an external device. A temperature sensor 21 detecting the temperature of the CCD is arranged near an electrode mounting section 20B on the flexible board 20, on which the electrode for the CCD is mounted.
COPYRIGHT: (C)2006,JPO&NCIPI
Inventors:
Satoshi Yoshizawa
Application Number:
JP2004153365A
Publication Date:
September 08, 2010
Filing Date:
May 24, 2004
Export Citation:
Assignee:
NIKON CORPORATION
International Classes:
G01K1/14; H04N5/225; H04N5/335; H04N5/372
Domestic Patent References:
| JP5183785A | ||||
| JP9304678A | ||||
| JP2000047179A | ||||
| JP5243621A |
Attorney, Agent or Firm:
Osamu Kiuchi