電子部品実装方法及び電子部品実装装置

Title:

電子部品実装方法及び電子部品実装装置

Document Type and Number:

Japanese Patent JP4540863

Kind Code:

B2

Inventors:

Keizo Izumida
Hiroki Yamamoto
Takeshi Kuribayashi

Application Number:

JP2001015962A

Publication Date:

September 08, 2010

Filing Date:

January 24, 2001

Export Citation:

Assignee:

Panasonic Corporation

International Classes:

H05K13/04

Domestic Patent References:

JP2000196296A

Attorney, Agent or Firm:

Shohei Oguri
Kimihide Hashimoto
Toshimitsu Ichikawa

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