Title:
半導体装置
Document Type and Number:
Japanese Patent JP4541597
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing the device from being mounted by mistake in a rotary attitude at an external circuit board. SOLUTION: The semiconductor device comprises a substrate of a substantially rectangular shape as planely observed having a first edge and a second edge opposed to the first edge, a semiconductor element mounted in an attitude sealed by a sealing resin on the substrate, a first connecting terminal group having a plurality of connecting terminals formed at the first edge, and a second connecting terminal group having a plurality of connecting terminals formed at the second edge. In this case, the first and second terminal groups are disposed in a point symmetry to a center of the substrate, and the terminals having the point symmetry of the first and second terminal groups are electrically energized with each other.
Inventors:
Horio Tomoharu
Application Number:
JP2001195736A
Publication Date:
September 08, 2010
Filing Date:
June 28, 2001
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L23/12; H01L25/16; H01L31/10
Domestic Patent References:
| JP10050879A | ||||
| JP7201505A | ||||
| JP5013615A | ||||
| JP60078146U | ||||
| JP3075673U |
Attorney, Agent or Firm:
Minoru Yoshida
Tatsuya Tanaka
Yoshikazu Fukumoto
Tatsuya Tanaka
Yoshikazu Fukumoto