Title:
半導体ウエハ保護用粘着シート及び半導体ウエハの研削方法
Document Type and Number:
Japanese Patent JP4544658
Kind Code:
B2
Inventors:
Koji Akazawa
Yoshio Nakagawa
Takahiro Fukuoka
Kouichi Hashimoto
Tatsuya Kubozono
Yoshio Nakagawa
Takahiro Fukuoka
Kouichi Hashimoto
Tatsuya Kubozono
Application Number:
JP2558899A
Publication Date:
September 15, 2010
Filing Date:
February 02, 1999
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C09J7/02; H01L21/304; C09J4/00
Domestic Patent References:
| JP7193032A | ||||
| JP7135189A | ||||
| JP10310748A |
Attorney, Agent or Firm:
Yukihisa Goto