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Title:
半導体スタックドパッケージ及びその製造方法
Document Type and Number:
Japanese Patent JP4544784
Kind Code:
B2
Inventors:
高橋 紀夫
Application Number:
JP2001175523A
Publication Date:
September 15, 2010
Filing Date:
June 11, 2001
Export Citation:
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Assignee:
OKIセミコンダクタ株式会社
International Classes:
H01L23/12; H01L25/065; H01L21/60; H01L25/07; H01L25/18
Domestic Patent References:
JP2000156460A
JP200168621A
JP2001102410A
JP200124149A
JP10242381A
Attorney, Agent or Firm:
鈴木 敏明



 
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