Title:
表面実装型LED
Document Type and Number:
Japanese Patent JP4547569
Kind Code:
B2
Abstract:
An LED can include a silicon substrate that has a conductive pattern including an LED chip equipped portion, a connection portion, and external electrodes. A glass frame can be anodic-bonded onto the silicon substrate, and can include a through-hole forming a lamp house. An LED chip can be mounted onto the silicon substrate in the through-hole of the glass frame, and a mold portion made of silicone resin can be filled into the through-hole of the glass frame.
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Inventors:
Tokairin Iwa
Application Number:
JP2004251240A
Publication Date:
September 22, 2010
Filing Date:
August 31, 2004
Export Citation:
Assignee:
Stanley Electric Co., Ltd.
International Classes:
H01L33/48; H01L33/50; H01L33/56; H01L33/64
Domestic Patent References:
| JP54529U | ||||
| JP2001319985A | ||||
| JP2004128393A | ||||
| JP2002314142A |
Attorney, Agent or Firm:
Shozo Igarashi