Title:
スリットノズル,基板処理装置,および基板処理方法
Document Type and Number:
Japanese Patent JP4549905
Kind Code:
B2
Abstract:
To provide technology for applying processing liquid from a slit nozzle by stable application width. In the slit nozzle, thickness (d) of a lower end 721a of a side plate 721 is set to be not more than 0.7 mm. Thus, swelling width of applied resist liquid 90 to an outer side can be made small even if moving speed of the slit nozzle 42 is slow and viscosity of resist liquid 90 is low. Consequently, fluctuation of application width of resist liquid 90 can be suppressed.
Inventors:
Fumihiko Ikeda
Kazuki Kajino
Akihiro Hosokawa
Junichi Yoshida
Kazuki Kajino
Akihiro Hosokawa
Junichi Yoshida
Application Number:
JP2005075402A
Publication Date:
September 22, 2010
Filing Date:
March 16, 2005
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
H01L21/027; B05C5/02; B05D1/26
Domestic Patent References:
| JP2002233805A | ||||
| JP200266420A | ||||
| JP2003260398A | ||||
| JP9164357A | ||||
| JP3500858A | ||||
| JP10235260A |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita