Title:
個片基板の製造方法および個片基板並びに集合基板
Document Type and Number:
Japanese Patent JP4554831
Kind Code:
B2
Inventors:
Morimoto Kazumi
Horio Tomoharu
Horio Tomoharu
Application Number:
JP2001035470A
Publication Date:
September 29, 2010
Filing Date:
February 13, 2001
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H05K1/02; H05K3/28; H01L21/301; H01L23/12; H05K3/00
Domestic Patent References:
| JP200091722A | ||||
| JP9181443A | ||||
| JP1146061A | ||||
| JP11163583A | ||||
| JP60194367U | ||||
| JP6046090A | ||||
| JP51125865A |
Attorney, Agent or Firm:
Minoru Yoshida
Tatsuya Tanaka
Yoshikazu Fukumoto
Tatsuya Tanaka
Yoshikazu Fukumoto