Title:
半導体基板の製造方法
Document Type and Number:
Japanese Patent JP4557505
Kind Code:
B2
Inventors:
Kurita Kuji
Koji Izumizuma
Masato Igarashi
Takeshi Senda
Yoshiaki Matsushita
Koji Izumizuma
Masato Igarashi
Takeshi Senda
Yoshiaki Matsushita
Application Number:
JP2003140274A
Publication Date:
October 06, 2010
Filing Date:
May 19, 2003
Export Citation:
Assignee:
Covalent Materials Co., Ltd.
International Classes:
H01L21/20; H01L29/161; H01L21/205; H01L21/324
Domestic Patent References:
| JP6252046A | ||||
| JP10256169A | ||||
| JP9051097A | ||||
| JP8321443A | ||||
| JP2000100680A | ||||
| JP2003347229A | ||||
| JP4324621A | ||||
| JP7094429A |
Other References:
志村 史夫,半導体シリコン結晶工学,日本,丸善株式会社,1993年 9月30日,p.33-34
Attorney, Agent or Firm:
Kinoshita Shigeru