Title:
温度測定デバイスおよびこのデバイスを製造する方法
Document Type and Number:
Japanese Patent JP4564968
Kind Code:
B2
Abstract:
A method of producing a device initially includes providing a component. The component includes a first surface, a second surface opposite the first surface, a first contact formed on the first surface, a second contact formed on the second surface, and an electrical circuit disposed between the first contact and the second contact. The component further includes a conductive connection between the first contact on the first surface of the component and the second surface of the component. A first conductive layer serving as the pad of the device is formed on the second surface of the component such that same is in contact with the conductive connection.
Inventors:
Heinrich Gitzmann
Georg Bernitz
Georg Bernitz
Application Number:
JP2006543498A
Publication Date:
October 20, 2010
Filing Date:
December 10, 2004
Export Citation:
Assignee:
Heinrich Zitzmann
Georg Bernitz
Georg Bernitz
International Classes:
G01K7/18; G01K7/16; H01C1/14; H01C7/10; H01C17/28
Domestic Patent References:
| JP2002535610A | ||||
| JP57173718A |
Foreign References:
| US6151771 |
Attorney, Agent or Firm:
Hidetaka Tsutsui