Title:
半導体装置
Document Type and Number:
Japanese Patent JP4568588
Kind Code:
B2
Inventors:
Toru Yagi
Hirofumi Inada
Hirofumi Inada
Application Number:
JP2004341361A
Publication Date:
October 27, 2010
Filing Date:
November 26, 2004
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H03K19/00
Domestic Patent References:
JP2002312042A | ||||
JP59218042A | ||||
JP2002076874A | ||||
JP11317649A | ||||
JP7038056A |
Attorney, Agent or Firm:
Shizuo Sano