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Title:
少なくとも1つの基板の表面を処理する方法および装置
Document Type and Number:
Japanese Patent JP4578979
Kind Code:
B2
Abstract:
A method for treating a surface of at least one substrate, wherein the at least one substrate is placed in a process chamber, wherein the pressure in the process chamber is relatively low, wherein a plasma is generated by at least one plasma source, wherein, during the treatment, at least one plasma source (3) and/or at least one optionally provided treatment fluid supply source is moved relative to the substrate surface. The invention further provides an apparatus for treating a surface of at least one substrate, wherein the apparatus is provided with a process chamber and at least one plasma source, wherein the at least one plasma source (3) and/or at least one optionally provided treatment fluid supply source is movably arranged.

Inventors:
Franciscus, Cornelius, Dinhus
Marinus, Francis Cous, Johannus, Ephers
Michael, adrinus, theodorus, homps
Martin, Dinant, Biker
Application Number:
JP2004558567A
Publication Date:
November 10, 2010
Filing Date:
December 12, 2003
Export Citation:
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Assignee:
OTB SOLAR B.V.
International Classes:
C23C16/50; C23C16/04; C23C16/513; H01J37/32; H01L21/205; H01L21/302; H05H1/24
Domestic Patent References:
JP64028297A
JP2001003175A
JP6330324A
JP61079774A
JP61262473A
JP1100265A
JP2000109979A
JP2002118027A
Foreign References:
US3735727
US6344416
Attorney, Agent or Firm:
Kenji Yoshitake
Hirohito Katsunuma
Hiroyuki Nagai
Junpei Okada
Katsuomi Isogai
Hiroki Kashima