To provide a method for accurately and firmly fixing a device in a predetermined location and electrically connecting a device semiconductor and an electric conductor layer with low resistance in a photoelectric converter that houses a global photoelectric conversion device within each concave of a base.

This method uses a device with an electrode formed on a surface exposed from a part of a second semiconductor layer coating a global first semiconductor. This device is adhered by pasting a conductive adhesive to the margins of a hole at the bottom of the concave of the conductive base, in such a way that the electrode faces the rear of the base. Next, it joins an electric insulating layer and a metal sheet to the rear of the base, and drills the electric insulating layer and metal sheet to expose the electrode so that conductive paste can be filled there. In this way, a photoelectric converter is made with the device electrodes connected in parallel.

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