Title:
バンプの接合方法およびバンプの接合構造体
Document Type and Number:
Japanese Patent JP4591529
Kind Code:
B2
Abstract:
In a method of bonding a first bump on a surface of a first member and a second bump on a surface of a second member, a tip portion of the first bump is provided with a projection having a hardness greater than a hardness of each of the first and second bumps. The first and second members are positioned with respect to each other such that the first and second bumps face each other. The tip portion of the first bump is brought into contact with a tip portion of the second bump by sticking the projection into the tip portion of the second bump.
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Inventors:
Masaaki Tanaka
Kimie Ayukawa
Kimie Ayukawa
Application Number:
JP2008079771A
Publication Date:
December 01, 2010
Filing Date:
March 26, 2008
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L21/60; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
| JP4116944A | ||||
| JP2002222832A | ||||
| JP2001102411A | ||||
| JP9223721A | ||||
| JP5135216A |
Attorney, Agent or Firm:
Yoji Ito
Takahiro Miura
Fumihiro Mizuno
Takahiro Miura
Fumihiro Mizuno