Title:
有機シラン化合物を含んでなる絶縁膜用材料、その製造方法および半導体デバイス
Document Type and Number:
Japanese Patent JP4591651
Kind Code:
B2
Inventors:
Daiji Hara
Keisuke Yoshida
Keisuke Yoshida
Application Number:
JP2003050894A
Publication Date:
December 01, 2010
Filing Date:
February 27, 2003
Export Citation:
Assignee:
Tosoh Corporation
International Classes:
C07F7/18; C23C16/42; H01L21/312
Domestic Patent References:
| JP4329639A | ||||
| JP6093451A | ||||
| JP10235779A | ||||
| JP2002256434A | ||||
| JP2001176869A | ||||
| JP5086069A | ||||
| JP4082892A | ||||
| JP2000302791A | ||||
| JP11031690A |