Title:
ダミーウエハ
Document Type and Number:
Japanese Patent JP4599293
Kind Code:
B2
Abstract:
A dummy wafer including a carbon fiber reinforced plastic (CFRP). Specifically the dummy wafer has a wafer substrate including CFRP, the substrate has two skin layers disposed on respective principal surface side and a core layer interposed between the skin layers, and each of the skin layers has multiple one-dimensionally reinforced layers consisting of a cured and shaped product of unidirectional prepreg. With reference to the orientation direction of one of the one-dimensionally reinforced layers on the side closest to the principal surface (outermost layer) in each of the skin layers, the other outermost layer is oriented in a specific direction; the tensile modulus of CF in each outermost layer is within a specific range; each skin layer has a one-dimensionally reinforced layer that contains CF oriented in a specific direction and has the tensile modulus within a specific range; and the core layer has a one-dimensionally reinforced layer that contains CF oriented in a specific direction and having the tensile modulus within a specific range, and a one-dimensionally reinforced layer that contains CF oriented in a specific direction and having the tensile modulus within a specific range. The dummy wafer has high strength, is inexpensive, and easily responds to light sensors.
Inventors:
Daisuke Uchida
Takashi Kobayashi
Kenichi Aoyagi
Shinichi Takemura
Takashi Kobayashi
Kenichi Aoyagi
Shinichi Takemura
Application Number:
JP2005504241A
Publication Date:
December 15, 2010
Filing Date:
March 30, 2004
Export Citation:
Assignee:
jx Nikko Nisseki Energy Co., Ltd.
International Classes:
H01L21/02; C08J5/04; H01L21/00
Domestic Patent References:
| JP2002274948A | 2002-09-25 | |||
| JP2000272040A | 2000-10-03 | |||
| JPH11124693A | 1999-05-11 |
Attorney, Agent or Firm:
Akio Miyazaki
Ishibashi Masayuki
Shinichi Iwata
Masaaki Ogata
Ishibashi Masayuki
Shinichi Iwata
Masaaki Ogata