Title:
貼り合わせウェーハの評価方法及び貼り合わせウェーハの評価装置
Document Type and Number:
Japanese Patent JP4617788
Kind Code:
B2
Inventors:
Naoto Tate
Ken Oshida
Ken Oshida
Application Number:
JP2004263574A
Publication Date:
January 26, 2011
Filing Date:
September 10, 2004
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
H01L27/12; G01B11/02; H01L21/02; H01L21/66
Domestic Patent References:
| JP2002305292A | ||||
| JP10223497A | ||||
| JP11026337A | ||||
| JP11287641A |
Attorney, Agent or Firm:
Mikio Yoshimiya