Title:
半導体基板及びその作製方法
Document Type and Number:
Japanese Patent JP4623451
Kind Code:
B2
Inventors:
Tadahiro Ohmi
Nobuyoshi Tanaka
Shinohara Tokuni
Ushiki Takeo
Yuhisa Nitta
Nobuyoshi Tanaka
Shinohara Tokuni
Ushiki Takeo
Yuhisa Nitta
Application Number:
JP21497198A
Publication Date:
February 02, 2011
Filing Date:
July 30, 1998
Export Citation:
Assignee:
Tadahiro Ohmi
Canon Inc
Canon Inc
International Classes:
H01L21/02; H01L27/12; H01L21/336; H01L29/786
Domestic Patent References:
| JP5217825A | ||||
| JP4283914A | ||||
| JP5217973A | ||||
| JP5217994A | ||||
| JP6296023A |
Other References:
Tadahiro OHMI,Trends for Future Silicon Technology,Jpn.J.Appl.Phys. Part 1,1994年12月,Vol.33,No.12B,P6747-6755
Attorney, Agent or Firm:
Okabe
Nobuaki Kato
Shinichi Usui
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi
Nobuaki Kato
Shinichi Usui
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi