Title:
表示装置の製造方法、表示装置および電子機器
Document Type and Number:
Japanese Patent JP4636921
Kind Code:
B2
Abstract:
A method of manufacturing a semiconductor device includes: forming a plurality of regions extending in a predetermined direction on a substrate; and ejecting a liquid material on the plurality of regions to form an electrically conductive film, wherein the electrically conductive film extends in the same direction as the plurality of regions so as to overlap the plurality of regions.
Inventors:
Takeo Kawase
Mari Sakai
Mari Sakai
Application Number:
JP2005099965A
Publication Date:
February 23, 2011
Filing Date:
March 30, 2005
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H01L29/786; G09F9/00; H01L21/28; H01L21/288; H01L21/3205; H01L21/336
Domestic Patent References:
| JP11207959A | ||||
| JP61245136A | ||||
| JP2275672A | ||||
| JP200551199A | ||||
| JP200564409A | ||||
| JP200524864A | ||||
| JP2004356599A |
Foreign References:
| WO2004097915A1 |
Attorney, Agent or Firm:
Tatsuya Masuda