Title:
多層回路基板の製法及び多層回路基板
Document Type and Number:
Japanese Patent JP4637984
Kind Code:
B2
More Like This:
Inventors:
Yasuhiro Wakisaka
Takeka Kato
Takeka Kato
Application Number:
JP32608699A
Publication Date:
February 23, 2011
Filing Date:
November 16, 1999
Export Citation:
Assignee:
Zeon Corporation
International Classes:
H05K1/03; H05K3/46
Domestic Patent References:
| JP1131883A | ||||
| JP5136575A | ||||
| JP8259784A |
Attorney, Agent or Firm:
Naoto Noda