Title:
キャパシタ回路付フィルムキャリアテープ及びその製造方法、キャパシタ回路付表面実装フィルムキャリアテープ及びその製造方法
Document Type and Number:
Japanese Patent JP4638768
Kind Code:
B2
Abstract:
The present invention provides a manufacturing method capable of mass production of a thin film decoupling capacitor provided with a capacitor circuit on the surface of a film tape carrier form of a polyimide resin or the like. For the purpose of achieving the above described object, there is provided a film carrier tape with a capacitor circuit, including a wiring pattern on the surface of a resin film including a plurality of sprocket holes on each of the two edges, wherein the resin film includes solder ball land holes and the wiring pattern includes a capacitor circuit having a structure in which a dielectric layer is disposed between an upper electrode and a lower electrode. As the method for manufacturing the aforementioned film carrier tape, there is provided such a method for semicontinuously manufacturing the film carrier tape concerned in the state of tape as applied to manufacturing conventional TAB products.
Inventors:
Yasuaki Masuko
Application Number:
JP2005148765A
Publication Date:
February 23, 2011
Filing Date:
May 20, 2005
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
H01L21/60; H01L23/12
Domestic Patent References:
| JP2002083892A | ||||
| JP2002093849A | ||||
| JP2001519600A | ||||
| JP2000183242A | ||||
| JP2001267360A | ||||
| JP2001338836A | ||||
| JP2005086036A | ||||
| JP6029347A |
Attorney, Agent or Firm:
Katsuhiro Yoshimura