To provide a wiring board capable of stably supplying power to a semiconductor element.
A core member 11 of the wiring board 10 has a housing hole 91 opened on a core first main surface 12 and a core second main surface 13, and a ceramic capacitor 101 is housed in the housing hole 91. A build-up layer 31 for supporting an IC chip 21 is formed on the core first main surface 12, and a build-up layer 32 to be connected to a mother board 60 is formed on the core second main surface 13. A through hole conductor 16 is formed in a hole 15 for a through hole of the core 11. Via conductors 131, 132 each having a cross sectional area larger than the cross sectional area of the through hole conductor 16 are formed in the ceramic capacitor 101.
COPYRIGHT: (C)2008,JPO&INPIT
Makoto Origuchi
Shinji Yuri
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