Title:
部分めっき装置及び部分めっき方法
Document Type and Number:
Japanese Patent JP4644528
Kind Code:
B2
Abstract:
A selective plating apparatus for applying selective electrolytic plating to a metal member includes: a mask member having a recess portion so that a space is formed to which predetermined parts of a surface of the metal member are exposed when the mask member is attached to the metal member, and having at least one supply opening for supplying electrolytic plating solution into the space and a discharge opening for discharging the electrolytic plating solution from the space both formed in a bottom portion of the recess portion; and at least one injection nozzle which injects the electrolytic plating solution in an oblique direction with respect to the predetermined parts of the surface of the metal member, and is arranged in vicinity of the supply opening.
Inventors:
Yoko Ogiwara
Takeshi Takano
Kazuo Nakabayashi
Takeshi Takano
Kazuo Nakabayashi
Application Number:
JP2005150625A
Publication Date:
March 02, 2011
Filing Date:
May 24, 2005
Export Citation:
Assignee:
Shinko Electric Industry Co., Ltd.
International Classes:
C25D5/02; H01L23/50
Domestic Patent References:
| JP3017298A | ||||
| JP62162263U | ||||
| JP63247392A | ||||
| JP63128195A |
Attorney, Agent or Firm:
Takao Watanuki
Horimai Kazuharu
Horimai Kazuharu