Title:
フェイスアップウェット処理用のウェーハ温度均一性を改善する装置
Document Type and Number:
Japanese Patent JP4644676
Kind Code:
B2
Abstract:
A method and apparatus for controlling a substrate temperature during an electroless deposition process. The apparatus includes a deposition cell configured to support a substrate at a position above a fluid distribution member. A heated fluid is dispensed from the fluid diffusion member and contacts the backside of the substrate, thus heating the substrate. The heated fluid is dispensed from apertures configured to maintain a constant temperature across the substrate surface. The method includes flowing a heated fluid through a diffusion member against a backside of the substrate in a configuration that is configured to generate a constant processing temperature across the front side of the substrate.
Inventors:
Pancham, Ian, A.
Nguyen, Sun, Tea.
Rosen, Gary, Jay.
Nguyen, Sun, Tea.
Rosen, Gary, Jay.
Application Number:
JP2006534275A
Publication Date:
March 02, 2011
Filing Date:
October 05, 2004
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
C23C18/31; C23C18/16; H01L21/00; H01L21/288
Domestic Patent References:
| JP2001508599A | ||||
| JP2003129250A | ||||
| JP2003129251A | ||||
| JP2003115474A | ||||
| JP2002129344A |
Attorney, Agent or Firm:
Koichi Tsujii
Sadao Kumakura
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda
Hiroshi Uesugi
Sadao Kumakura
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda
Hiroshi Uesugi