Title:
半導体封止材料の製造方法、製造装置
Document Type and Number:
Japanese Patent JP4647223
Kind Code:
B2
Inventors:
Toshio Kinoshita
Akira Kimura
Toshiki Aoki
Akira Kimura
Toshiki Aoki
Application Number:
JP2004094937A
Publication Date:
March 09, 2011
Filing Date:
March 29, 2004
Export Citation:
Assignee:
Kyocera Chemical Co., Ltd.
International Classes:
C08J3/12; H01L21/56
Domestic Patent References:
| JP8337635A | ||||
| JP7242731A | ||||
| JP2000129139A | ||||
| JP2002201288A | ||||
| JP6216172A | ||||
| JP2003311738A | ||||
| JP8073605A |
Attorney, Agent or Firm:
Saichi Suyama