Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4654395
Kind Code:
B2
Inventors:
Ikuo Fujiwara
Takayuki Ogura
Tetsuro Endo
Fujio Masuoka
Takayuki Ogura
Tetsuro Endo
Fujio Masuoka
Application Number:
JP20983299A
Publication Date:
March 16, 2011
Filing Date:
July 23, 1999
Export Citation:
Assignee:
National Institute of Information and Communications Technology
Toshiba Corporation
Sharp Corporation
Toshiba Corporation
Sharp Corporation
International Classes:
H01L29/78; H01L21/265; H01L21/336; H01L21/8234; H01L27/088
Domestic Patent References:
| JP3142971A | ||||
| JP11154749A | ||||
| JP4067679A | ||||
| JP3211883A | ||||
| JP3071671A | ||||
| JP6021451A | ||||
| JP7202010A |
Attorney, Agent or Firm:
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Shoji Kawai
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Shoji Kawai