Title:
円盤状化合物を用いた表面処理法、表面処理用(潤滑)組成物及び表面処理された物品
Document Type and Number:
Japanese Patent JP4660234
Kind Code:
B2
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Inventors:
Masayuki Negoro
Kawada Ken
Kawada Ken
Application Number:
JP2005073286A
Publication Date:
March 30, 2011
Filing Date:
March 15, 2005
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
C10M133/42; C10M129/70; C10M133/40; C10M135/34; C10M137/16; C10M139/00; C10N30/00; C10N30/06; C10N40/36
Domestic Patent References:
| JP2003064389A | ||||
| JP2003064390A | ||||
| JP2003192677A | ||||
| JP2002069472A | ||||
| JP2004331950A | ||||
| JP57117597A | ||||
| JP2005047880A | ||||
| JP60099200A | ||||
| JP50090858A |
Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes