Title:
枚葉式の処理装置
Document Type and Number:
Japanese Patent JP4660926
Kind Code:
B2
Abstract:
A processing unit of the invention is a single wafer processing unit including: a processing container that can be vacuumed; a stage arranged in the processing container, on which an object to be processed can be placed; a dischargingpipe connected to a bottom part of the processing container and extending substantially downward linearly; a vacuum pump directly connected to the discharging pipe; and a stage-supporting pillar arranged to extend in a substantially central portion of the discharging pipe and in a direction of the discharging pipe, the stage-supporting pillar supporting the stage.
Inventors:
Iizuka Yashiro
Application Number:
JP2001001152A
Publication Date:
March 30, 2011
Filing Date:
January 09, 2001
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
C23C14/50; H01L21/3065; C23C14/54; C23C16/44; C23C16/455; C23C16/458; H01J37/32; H01L21/00; H01L21/205; H01L21/22; H01L21/302; H01L21/324
Domestic Patent References:
| JP1272769A | ||||
| JP2000513501A |
Attorney, Agent or Firm:
Akihiro Asai