Title:
電子部品内蔵型回路基板の製造方法
Document Type and Number:
Japanese Patent JP4660946
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a circuit board with built-in electronic parts for which circuit design becomes easier without increasing the number of via holes for outside connection. SOLUTION: On this circuit board 10 with built-in electronic parts, at least two IC chips 1 each carrying a plurality of bumps 3 on its active surface are mounted on an electric conductor layer L2 on which a wiring circuit is formed, and an insulating layer I1 and an electric conductor layer L1 are successively formed on each chip 1. One of the IC chips 1 is mounted on the conductor layer L2 in a state where the active surface of the chip 1 is faced to the conductor layer L1, and the bumps 3 are connected to the layer L1. The other chip 1 is mounted on the electric conductor layer L2 in a state where the active surface of the chip 1 is faced to the layer L2 and the bumps 3 are connected to the layer L2.
Inventors:
Katsuhiro Yoneyama
Application Number:
JP2001077053A
Publication Date:
March 30, 2011
Filing Date:
March 16, 2001
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H05K3/28; H01L25/04; H01L25/18; H05K3/40; H05K3/46
Domestic Patent References:
| JP2000174442A | ||||
| JP10223832A |
Attorney, Agent or Firm:
Kenichiro Matsuo