Title:
シート貼付装置
Document Type and Number:
Japanese Patent JP4666519
Kind Code:
B2
Abstract:
A sheet sticking apparatus 10 is so arranged as to include a table 11 for supporting a semiconductor wafer W, and a pressing member 12 for pressing down a sheet S disposed along the semiconductor wafer W. The pressing member 12 includes a pressing surface 21 arranged to have an inclined surface or curved-form where a central area is closer to a semiconductor wafer W than a peripheral side, and a deformable portion 23 connected to the peripheral side thereof. The deformable portion 23 is adapted to be deformable caused by decompression difference within a second space S 2 formed between the pressing member 12 and an upper case 30 . The deformation of the deformable portion 23 causes the surface position of the pressing surface 21 to come down, and the distribution of the pressing force is spread from the central area toward the peripheral side, thereby exerting a sticking pressure to the sheet S.
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Inventors:
Nakata Miki
Kenji Kobayashi
Kenji Kobayashi
Application Number:
JP2006244673A
Publication Date:
April 06, 2011
Filing Date:
September 08, 2006
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
H01L21/683
Domestic Patent References:
| JP10233430A | ||||
| JP2004153159A | ||||
| JP6097268A | ||||
| JP3011749A |
Attorney, Agent or Firm:
Yoshio Yamaguchi