Title:
スルーホールや凹みを有する回路板をパルス状刺激での処理するための装置と方法
Document Type and Number:
Japanese Patent JP4669647
Kind Code:
B2
Abstract:
The method involves transporting the circuit boards (LP) through a treatment unit (1). The boards are moved by pairs of rollers (13,14), in a horizontal transport path and on a transport plane (2) and they are brought into contact with a treatment fluid. An impulse wave generator mechanism (50) transmits mechanical impulses (57) direct to each circuit board, using the transport device and/or the treatment fluid. The strength of the waves is increased by placing plates or foils, to act as reflectors (58) on the side of the side remote from each impulse generator mechanism. There may be two impulse generator mechanisms, one on either side of the path followed by the circuit boards.
Inventors:
Schroeder Rolf
De Boer Reinhard
Grapentin Hans Joachim
Chechka Regina
De Boer Reinhard
Grapentin Hans Joachim
Chechka Regina
Application Number:
JP2001568668A
Publication Date:
April 13, 2011
Filing Date:
March 21, 2001
Export Citation:
Assignee:
Atotehi Deutschland Gesellschaft Mitt Beschlenktel Haftung
International Classes:
C25D7/00; H05K3/18; C25D7/06; C25D21/04; H05K3/00; H05K3/26
Domestic Patent References:
| JP677624A | ||||
| JP7263840A | ||||
| JP2002506483A | ||||
| JP10102297A |
Attorney, Agent or Firm:
Fujita Akira