Title:
多層プリント回路基板と電子機器
Document Type and Number:
Japanese Patent JP4671333
Kind Code:
B2
Inventors:
Masahiro Shirahashi
Application Number:
JP2005078497A
Publication Date:
April 13, 2011
Filing Date:
March 18, 2005
Export Citation:
Assignee:
株式会社リコー
International Classes:
H05K3/46; H05K1/02; H05K9/00
Domestic Patent References:
JP10056245A | ||||
JP7045962A | ||||
JP2002368355A | ||||
JP2003163466A | ||||
JP11340629A | ||||
JP2001267702A | ||||
JP7111387A | ||||
JP2001025334A |
Attorney, Agent or Firm:
Masayuki Watanabe