Title:
液体と基板との接触領域を拡大する方法
Document Type and Number:
Japanese Patent JP4672109
Kind Code:
B2
Abstract:
An apparatus to dispense a droplet of liquid, such as solder flux, onto the surface of a substrate, such as a printed circuit board, and thereafter flatten the droplet with a burst of pressurized air directed onto the droplet. A dispenser has a dispenser body (12), which has a liquid supply passageway (56) adapted to connect to a source of liquid. A nozzle body(14) connects to the dispenser body (12) and includes a liquid discharge passageway (58a) in fluid communication with the liquid supply passageway (56). The nozzle body (14) also has an air discharge orifice (72) which is adapted to connect to a source of pressurized air for selectively discharging bursts of pressurized air. The air discharge orifice (72) is configured and aligned with the liquid discharge passageway (58a) so that the discharged bursts of pressurized air impinge upon one of the droplets of liquid dispensed from the liquid discharge passageway (58a) so as to flatten that droplet and thereby increase the contact area between the droplet and the substrate.
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Inventors:
William E. Donges
James C. Smith
James C. Smith
Application Number:
JP2000166245A
Publication Date:
April 20, 2011
Filing Date:
June 02, 2000
Export Citation:
Assignee:
NORDSON CORPORATION
International Classes:
B05B1/26; B05B7/04; B05C5/00; B05C5/02; B05C11/06; B05C11/10; H05K3/34; B05B7/06
Domestic Patent References:
| JP56052062U | ||||
| JP2203957A | ||||
| JP4500928A |
Foreign References:
| US5356050 |
Attorney, Agent or Firm:
Okabe
Masao Okabe
Nobuaki Kato
Kazuo
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi
Koji Yoshizawa
Masao Okabe
Nobuaki Kato
Kazuo
Shinichi Usui
Ikuo Fujino
Takao Ochi
Teruhisa Motomiya
Norimichi Takanashi
Asahi Shinmitsu
Seiichiro Takahashi
Koji Yoshizawa