Title:
半導体装置
Document Type and Number:
Japanese Patent JP4673569
Kind Code:
B2
Abstract:
A semiconductor apparatus is disclosed. The semiconductor apparatus comprises a substrate with a pad, an internal circuitry region, and a protection resistance formed on the substrate. The pad is connected to a first electrode of the protection resistance by wiring, the internal circuitry region is connected to a second electrode of the protection resistance by wiring, and the protection resistance protects the internal circuitry region from electrostatic discharging. The semiconductor apparatus is characterized in that the pad is placed between the protection resistance and the internal circuitry region.
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Inventors:
Hideto Uesato
Koji Yoshii
Okuda
Koji Yoshii
Okuda
Application Number:
JP2004104136A
Publication Date:
April 20, 2011
Filing Date:
March 31, 2004
Export Citation:
Assignee:
株式会社リコー
International Classes:
H01L27/04; H01L21/822; H01L23/60; H01L23/62; H01L27/02; H01L27/06
Domestic Patent References:
| JP9116097A | ||||
| JP6188369A | ||||
| JP2278864A | ||||
| JP60257558A | ||||
| JP3173468A | ||||
| JP11220094A |
Attorney, Agent or Firm:
Takuji Yamada