Title:
スパッタリング装置および成膜方法
Document Type and Number:
Japanese Patent JP4685228
Kind Code:
B2
Inventors:
Aida Hisashi
Yuichi Wada
Youth base
Yuichi Wada
Youth base
Application Number:
JP2000333020A
Publication Date:
May 18, 2011
Filing Date:
October 31, 2000
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
C23C14/35; H01L21/203; H01L21/285
Domestic Patent References:
| JP7252651A | ||||
| JP9041135A | ||||
| JP9041137A | ||||
| JP10152774A |
Attorney, Agent or Firm:
Koichi Tsujii
Sadao Kumakura
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda
Hiroshi Uesugi
Yoshiki Hasegawa
Yuichi Yamada
Ichira Kondo
Sadao Kumakura
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda
Hiroshi Uesugi
Yoshiki Hasegawa
Yuichi Yamada
Ichira Kondo