Title:
被覆導電粒子、異方性導電材料及び導電接続構造体
Document Type and Number:
Japanese Patent JP4686120
Kind Code:
B2
More Like This:
Inventors:
Shigeo Mahara
Takeshi Wakiya
Takeshi Wakiya
Application Number:
JP2003381658A
Publication Date:
May 18, 2011
Filing Date:
November 11, 2003
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H01B5/00; H01R11/01; H01B1/22; H01B5/16
Domestic Patent References:
| JP2006525641A | ||||
| JP2003026813A | ||||
| JP3112011A |
Foreign References:
| WO2003025955A1 |