Title:
電子装置アレイ及びその製作方法
Document Type and Number:
Japanese Patent JP4688413
Kind Code:
B2
Abstract:
A sensor array includes a substrate including a front side and a back side, a plurality of transducers fabricated on the front side of the substrate, a plurality of input/output connections positioned on the back side of the substrate, the input/output connections electrically coupled to the transducers, at least one electronic device, and an interposer positioned between the substrate and the electronic device, the interposer including a multilayer interconnect system configured to electrically connect the input/output connections to the electronic device.
Inventors:
William E. Burdick, Junior
James W. Rose
Donna M Sherman
James E. Sabatini
George Edward Poshin
James W. Rose
Donna M Sherman
James E. Sabatini
George Edward Poshin
Application Number:
JP2003406755A
Publication Date:
May 25, 2011
Filing Date:
December 05, 2003
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
G01J1/02; G01D5/00; G01T1/20; G01T1/29; G01T7/00; H01L27/146; H01L31/09; H01L31/10; H01R12/16; H04N3/15; H04N5/335; H04N
Domestic Patent References:
| JP2001292496A | ||||
| JP2002500763A | ||||
| JP2598482B2 | ||||
| JP2000164422A |
Attorney, Agent or Firm:
Arakawa Satoshi
Hirokazu Ogura
Nobukazu Ito
Hirokazu Ogura
Nobukazu Ito