Title:
充填装置
Document Type and Number:
Japanese Patent JP4691792
Kind Code:
B2
Inventors:
Hideaki Hirose
Kenichi Tsukano
Kenichi Tsukano
Application Number:
JP2001025796A
Publication Date:
June 01, 2011
Filing Date:
February 01, 2001
Export Citation:
Assignee:
Shibuya Industry Co., Ltd.
International Classes:
B65B3/26; B67C3/20
Domestic Patent References:
| JP9066905A | ||||
| JP2853240B2 | ||||
| JP10120089A | ||||
| JP7187292A |
Attorney, Agent or Firm:
Mamoru Aikawa