Title:
鉛フリーはんだ材料
Document Type and Number:
Japanese Patent JP4703492
Kind Code:
B2
Abstract:
To provide a lead-free solder material capable of reducing the probability that a semi-conductor element is cracked without considerably raising the working temperature.
The lead-free solder material consists of an alloy material containing a first eutectic alloy and a second eutectic alloy. The first eutectic alloy consists of a Zn-Al alloy, the second eutectic alloy consists of a Ge-Ni alloy, and the alloy material further contains Sn. In the lead-free solder material, the amount of Sn contained in the alloy material is 0.05-2 pts.wt. to the total 100 pts.wt. of the first and second eutectic alloys.
COPYRIGHT: (C)2008,JPO&INPIT
Inventors:
Shigeki Sakaguchi
Kenichiro Suetsugu
Kenichiro Suetsugu
Application Number:
JP2006160824A
Publication Date:
June 15, 2011
Filing Date:
June 09, 2006
Export Citation:
Assignee:
Panasonic Corporation
International Classes:
B23K35/28; C22C18/04
Domestic Patent References:
| JP11288955A | ||||
| JP53124150A | ||||
| JP4258397A | ||||
| JP62173095A |
Attorney, Agent or Firm:
Kazuo Ishii
Shinichi Kawasaki
Shinichi Kawasaki