Title:
冷却機構及び処理装置
Document Type and Number:
Japanese Patent JP4720019
Kind Code:
B2
Abstract:
A processing apparatus is provided with a showerhead for introducing a process gas into a processing vessel, and heaters for heating the showerhead to an elevated temperature. The processing apparatus is provided with a main flow line for a cooling liquid, and a bypass flow line connected to the main flow line so as to bypass the showerhead. A cooling liquid control system for controlling the flow of the cooling liquid includes shutoff valves, and a valve controller. The cooling liquid control system controls the flow of the cooling liquid such that the cooling liquid is prevented from flowing through the cooling passage while the showerhead is being heated to the elevated temperature, and such that the cooling liquid is made to flow through both the cooling passage and the bypass flow line while the showerhead is being cooled to a reduced temperature.
More Like This:
JPS5878142 | 【考案の名称】反応ガス供給装置 |
JPH06216037 | HETERO-EPITAXIAL GROWTH METHOD |
WO/1998/047613 | SYSTEMS AND METHODS FOR THE COMBINATORIAL SYNTHESIS OF NOVEL MATERIALS |
Inventors:
Koichi Yamazaki
Application Number:
JP2001150101A
Publication Date:
July 13, 2011
Filing Date:
May 18, 2001
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
C23C16/44; F25D9/00; C23C16/455; C23C16/52; H01L21/00; H01L21/205; H01L21/302; H01L21/3065; H01L21/31
Domestic Patent References:
JP10116822A | ||||
JP10317142A |
Attorney, Agent or Firm:
Akihiro Asai