Title:
ハニカム構造体成形用口金の裏孔形成方法
Document Type and Number:
Japanese Patent JP4723269
Kind Code:
B2
More Like This:
Inventors:
Seiichiro Hayashi
Application Number:
JP2005085949A
Publication Date:
July 13, 2011
Filing Date:
March 24, 2005
Export Citation:
Assignee:
Nippon Insulator Co., Ltd.
International Classes:
B23H3/04; B23H9/14; B28B3/26
Domestic Patent References:
| JP2004291163A | ||||
| JP7040146A |
Attorney, Agent or Firm:
Ippei Watanabe