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Title:
電子部品ケース用包材及び電子部品用ケース
Document Type and Number:
Japanese Patent JP4732884
Kind Code:
B2
Abstract:

To provide a wrapping material for an electronic component case showing a superior rigidity and capable of attaining a superior outer appearance with hardly allowing visual recognition of roll traces, scratches or the like on an aluminum foil even if a rolled trace or a scratch or the like is left at an aluminum foil.

This wrapping material for electronic component cases comprises a heat-resistant resin oriented film layer 2 acting as an outer layer, a thermoplastic resin non-oriented film layer 3 acting as an inner layer, and an aluminum foil layer 4 arranged between these film layers. The aluminum foil layer 4 is made by laminating a hard aluminum foil 5 arranged at the inner layer 3 and an aluminum foil 6 on the outer layer 2 in which at least the outer layer is formed as a mat surface.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
Hiroshi Hata
Application Number:
JP2005361195A
Publication Date:
July 27, 2011
Filing Date:
December 15, 2005
Export Citation:
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Assignee:
Showa Denko Packaging Co., Ltd.
International Classes:
B65D65/40; H01G9/08; H01M2/02
Domestic Patent References:
JP2001057181A
JP2005166650A
JP2004042477A
JP2001236931A
JP62041046U
JP2003217529A
JP62052061A
Attorney, Agent or Firm:
Hisayoshi Shimizu
Ken Takada
Yoshihito Shimizu



 
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