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Title:
エッチング方法及び半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4738194
Kind Code:
B2
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Inventors:
Daisuke Watanabe
Application Number:
JP2006033083A
Publication Date:
August 03, 2011
Filing Date:
February 09, 2006
Export Citation:
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Assignee:
Shibaura Mechatronics Co., Ltd.
International Classes:
H01L21/3065; H01L29/78; H01L29/786
Domestic Patent References:
JP2004047631A
Other References:
V.CAUBET et.al.,Impact of Tunnel Eching Process on Electrical Performances of SON Devices,Japanese Journal of Applied Physics,日本,2005年 7月26日,vol.44,No.7B,pp.5795-5798
Attorney, Agent or Firm:
Masahiko Hinataji



 
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