Title:
発光素子実装用サブマウント基板及びその製造方法
Document Type and Number:
Japanese Patent JP4742385
Kind Code:
B2
Abstract:
A submount substrate (300) for mounting a light emitting device (400) and a method of fabricating the same, wherein since a submount substrate for mounting a light emitting device in which a Zener diode device is integrated can be fabricated by means of a silicon bulk micromachining process without using a diffusion mask, some steps of processes related to the diffusion mask can be eliminated to reduce the manufacturing costs, and wherein since a light emitting device can be flip-chip bonded directly to a submount substrate for a light emitting device in which a Zener diode device is integrated, a process of packaging the light emitting device and the voltage regulator device can be simplified.
Inventors:
Kim Kon Ho
Park Children
Park Children
Application Number:
JP2005196337A
Publication Date:
August 10, 2011
Filing Date:
July 05, 2005
Export Citation:
Assignee:
LG ELECTRONICS INC.
International Classes:
H01L33/62; H01L23/14; H01L29/866; H01L33/32; H01L33/60
Domestic Patent References:
| JP2000106458A | ||||
| JP63099585A | ||||
| JP6090010A | ||||
| JP7147419A | ||||
| JP11251644A | ||||
| JP11354848A | ||||
| JP2002270905A | ||||
| JP54109779A | ||||
| JP7297480A |
Attorney, Agent or Firm:
Calyx
Miyazaki Yoshio
Kaoru Onozuka
Akio Tagami
High Masahiro
Toshio Nakamura
Tsutomu Kato
Yusuke Murakoshi
Tomoaki Komiya
Miyazaki Yoshio
Kaoru Onozuka
Akio Tagami
High Masahiro
Toshio Nakamura
Tsutomu Kato
Yusuke Murakoshi
Tomoaki Komiya