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Patent Searching and Data


Title:
適応可能なペイロードを可能にする構成
Document Type and Number:
Japanese Patent JP4744508
Kind Code:
B2
Abstract:
Apparatus and methods for situating and securing payloads to support structures are disclosed. In one embodiment, an assembly includes a support structure, a floor assembly, and a payload assembly. The floor assembly includes a plurality of elongated engagement members coupled to the support structure, the engagement members being spaced apart and mostly parallel, each engagement member including an engagement surface. The payload assembly includes a payload component positioned proximate the floor assembly, and at least one payload support coupled to the payload component and engaged with at least some of the engagement members, the payload support being adapted to beam loads from the payload component to the floor assembly and being moveable with the payload component relative to the floor assembly.

Inventors:
Martin Earl
Reed, Raymond Earl
Franz, W Forest
Pishke, Gina Zee
Morgan, Kelly El
Fortard, Paul Earl
Jones, Todd Evan
Hackett, Douglas W
Application Number:
JP2007506414A
Publication Date:
August 10, 2011
Filing Date:
March 28, 2005
Export Citation:
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Assignee:
The Boeing Company
International Classes:
B64C1/20; B64C1/18; B64D9/00
Foreign References:
US6068214
US5322244
US5083727
US4875645
US4077590
DE19742772A1
DE10145276A1
GB706614A
Attorney, Agent or Firm:
Sonoda Yoshitaka
Kobayashi Yoshinori