Title:
半導体素子パッケージ
Document Type and Number:
Japanese Patent JP4745104
Kind Code:
B2
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Inventors:
Go Hasegawa
Seiji Ito
Seiji Ito
Application Number:
JP2006097540A
Publication Date:
August 10, 2011
Filing Date:
March 31, 2006
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
H01L23/40; H01L23/02
Domestic Patent References:
| JP59155157A | ||||
| JP10107476A | ||||
| JP2000278202A | ||||
| JP2003051572A | ||||
| JP47030397B1 |
Attorney, Agent or Firm:
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto
Makoto Nakamura
Kurata Masatoshi
Takashi Mine
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto