回路組立体および集積回路デバイスに放熱器を接続する方法

Japanese Patent JP4746283

B2

A circuit board assembly includes an integrated circuit package. A first substrate has first and second surfaces. Each surface of the first substrate has a plurality of terminal pads. An integrated circuit device has first and second faces. The first face has a plurality of electrical interconnections to the terminal pads in the first surface of the first substrate. A heatspreader plate has a plurality of legs. For example, the heatspreader may be shaped like a table with four legs. The heatspreader may be formed of copper. The second face of the integrated circuit device is connected to the heatspreader plate by a first thermal interface material. Each of the plurality of legs is connected to the first surface of the first substrate by a second thermal interface material. The first and second thermal interface materials may both be, for example, a conductive silver-filled epoxy. The heatspreader provides an open package that is easily cleaned and drained. A second substrate (which may be a motherboard, system board, or other printed circuit board) has a plurality of terminal pads. The terminal pads of the second substrate are connected to the terminal pads of the second surface of the first substrate. In an alternative (direct chip attach) configuration, the flip chip device and the heatspreader may be directly connected to a printed circuit board, which may be a motherboard or other system board.

David Rishner
Raymond Jay Nika
James robert ronemus

JP2004175054A

August 10, 2011

June 14, 2004

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Alcatel-Lucent USA Inc.

H01L23/40; H01L23/34; H01L23/36

JP878584A
JP559849U

Okabe
Masao Okabe
Nobuaki Kato
Shinichi Usui
Takao Ochi
Asahi Shinmitsu

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