Title:
半導体装置および基板
Document Type and Number:
Japanese Patent JP4752369
Kind Code:
B2
Abstract:
A semiconductor device includes a first substrate having a first surface for mounting an electronic component and a second surface substantially parallel to the first surface. The first substrate includes a first region for mounting the electronic component, a second region including a plurality of first communication units for transmitting and receiving signals to and from a second substrate, input-output circuits disposed on the first region or the second region, the input-out circuits corresponding to the first communication units, and a control circuit for controlling input to and output from the input-output circuits disposed on the first region or the second region of the first substrate. Each of the input-output circuits includes an output circuit for outputting a signal to a second communication unit of the second substrate corresponding to the first communication unit and an input unit for receiving a signal sent from the corresponding second communication unit.
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Inventors:
Shunichi Sukegawa
Takeo Sekino
Kenichi Shigenami
Shinichi Azumai
Tatsuo Shimizu
Takeo Sekino
Kenichi Shigenami
Shinichi Azumai
Tatsuo Shimizu
Application Number:
JP2005211753A
Publication Date:
August 17, 2011
Filing Date:
July 21, 2005
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L25/065; H01L23/12; H01L23/52; H01L25/07; H01L25/18
Domestic Patent References:
| JP2001273755A | ||||
| JP2002359343A | ||||
| JP11168157A | ||||
| JP8316408A |
Attorney, Agent or Firm:
Yoshio Inamoto